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TPA2012D2RTJTG4 参数 Datasheet PDF下载

TPA2012D2RTJTG4图片预览
型号: TPA2012D2RTJTG4
PDF下载: 下载PDF文件 查看货源
内容描述: 2.1 W / CH立体声无滤波器D类音频功率放大器 [2.1 W/CH STEREO FILTER-FREE CLASS-D AUDIO POWER AMPLIFIER]
分类和应用: 消费电路商用集成电路音频放大器视频放大器功率放大器LTE
文件页数/大小: 20 页 / 758 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TPA2012D2  
www.ti.com  
SLOS438CDECEMBER 2004REVISED MARCH 2007  
BOARD LAYOUT  
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined  
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the  
opening size is defined by the copper pad width. Figure 36 and Table 2 shows the appropriate diameters for a  
WCSP layout. The TPA2012D2 evaluation module (EVM) layout is shown in the next section as a layout  
example.  
Copper  
Trace Width  
Solder  
Pad Width  
Solder Mask  
Opening  
Copper Trace  
Thickness  
Solder Mask  
Thickness  
Figure 36. Land Pattern Dimensions  
Table 2. Land Pattern Dimensions(1)(2)(3)(4)  
(5)  
(6)(7)  
SOLDER PAD  
DEFINITIONS  
COPPER  
PAD  
SOLDER MASK  
OPENING  
COPPER  
THICKNESS  
STENCIL  
STENCIL  
THICKNESS  
OPENING  
Nonsolder mask  
defined (NSMD)  
275 µm  
(+0.0, -25 µm)  
275 µm x 275 µm Sq.  
(rounded corners)  
375 µm (+0.0, -25 µm)  
1 oz max (32 µm)  
125 µm thick  
(1) Circuit traces from NSMD defined PWB lands should be 75 µm to 100 µm wide in the exposed area inside the solder mask opening.  
Wider trace widths reduce device stand off and impact reliability.  
(2) Best reliability results are achieved when the PWB laminate glass transition temperature is above the operating the range of the  
intended application.  
(3) Recommend solder paste is Type 3 or Type 4.  
(4) For a PWB using a Ni/Au surface finish, the gold thickness should be less 0.5 mm to avoid a reduction in thermal fatigue performance.  
(5) Solder mask thickness should be less than 20 µm on top of the copper circuit pattern  
(6) Best solder stencil performance is achieved using laser cut stencils with electro polishing. Use of chemically etched stencils results in  
inferior solder paste volume control.  
(7) Trace routing away from WCSP device should be balanced in X and Y directions to avoid unintentional component movement due to  
solder wetting forces.  
Component Location  
Place all the external components very close to the TPA2012D2. Placing the decoupling capacitor, CS, close to  
the TPA2012D2 is important for the efficiency of the Class-D amplifier. Any resistance or inductance in the trace  
between the device and the capacitor can cause a loss in efficiency.  
13  
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