TPA2010D1
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SLOS417B–OCTOBER 2003–REVISED JULY 2006
C
I1
R
I1
Single-Ended
Input 1
To Battery
Internal
V
DD
Oscillator
C
S
C
I2
R
I2
Single-Ended
Input 2
IN-
V
O+
PWM
H-
Bridge
_
+
V
O-
R
P
IN+
C
P
GND
Bias
Circuitry
SHUTDOWN
Filter-Free Class D
Figure 32. Application Schematic With TPA2010D1 Summing Two Single-Ended Inputs
BOARD LAYOUT
In making the pad size for the WCSP balls, it is recommended that the layout use nonsolder mask defined
(NSMD) land. With this method, the solder mask opening is made larger than the desired land area, and the
opening size is defined by the copper pad width. Figure 33 and Table 2 show the appropriate diameters for a
WCSP layout. The TPA2010D1 evaluation module (EVM) layout is shown in the next section as a layout
example.
Copper
Trace Width
Solder
Pad Width
Solder Mask
Opening
Copper Trace
Thickness
Solder Mask
Thickness
Figure 33. Land Pattern Dimensions
14
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