TPA005D02
2-W STEREO CLASS-D AUDIO POWER AMPLIFIER
SLOS227C – AUGUST 1998 – REVISED MARCH 2000
MECHANICAL DATA
DCA (R-PDSO-G**)
PowerPAD PLASTIC SMALL-OUTLINE PACKAGE
48 PINS SHOWN
0,27
0,17
M
0,08
0,50
48
25
Thermal Pad
(See Note D)
6,20
6,00
8,30
7,90
0,15 NOM
Gage Plane
1
24
0,25
A
0°–8°
0,75
0,50
Seating Plane
0,10
0,15
0,05
1,20 MAX
PINS **
48
56
64
DIM
12,60
12,40
14,10
13,90
17,10
16,90
A MAX
A MIN
4073259/A 01/98
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. The package thermal performance may be enhanced by bonding the thermal pad to an external thermal plane.
This pad is electrically and thermally connected to the backside of the die and possibly selected leads.
E. Falls within JEDEC MO-153
PowerPAD is a trademark of Texas Instruments.
24
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
TI [ TEXAS INSTRUMENTS ]
