TPA005D02
2-W STEREO CLASS-D AUDIO POWER AMPLIFIER
SLOS227C – AUGUST 1998 – REVISED MARCH 2000
THERMAL INFORMATION
The thermally enhanced DCA package is based on the 56-pin TSSOP, but includes a thermal pad (see Figure 11)
to provide an effective thermal contact between the IC and the PWB.
Traditionally, surface mount and power have been mutually exclusive terms. A variety of scaled-down TO-220-type
packages have leads formed as gull wings to make them applicable for surface-mount applications. These packages,
however, have only two shortcomings: they do not address the very low profile requirements (<2 mm) of many of
today’s advanced systems, and they do not offer a terminal-count high enough to accommodate increasing
integration. Ontheotherhand, traditionallow-powersurface-mountpackagesrequirepower-dissipationderatingthat
severely limits the usable range of many high-performance analog circuits.
The PowerPAD package (thermally enhanced TSSOP) combines fine-pitch surface-mount technology with thermal
performance comparable to much larger power packages.
The PowerPAD package is designed to optimize the heat transfer to the PWB. Because of the very small size and
limited mass of a TSSOP package, thermal enhancement is achieved by improving the thermal conduction paths that
remove heat from the component. The thermal pad is formed using a patented lead-frame design and manufacturing
technique to provide a direct connection to the heat-generating IC. When this pad is soldered or otherwise thermally
coupled to an external heat dissipator, high power dissipation in the ultra-thin, fine-pitch, surface-mount package can
be reliably achieved.
DIE
Side View (a)
Thermal
Pad
DIE
End View (b)
Bottom View (c)
Figure 11. Views of Thermally Enhanced DCA Package
selection of components
Figure 12 is a schematic diagram of a typical notebook computer application circuit.
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