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TMS320F28232ZJZQ 参数 Datasheet PDF下载

TMS320F28232ZJZQ图片预览
型号: TMS320F28232ZJZQ
PDF下载: 下载PDF文件 查看货源
内容描述: 数字信号控制器(DSC ) [Digital Signal Controllers (DSCs)]
分类和应用: 微控制器和处理器外围集成电路数字信号处理器时钟
文件页数/大小: 195 页 / 2496 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TMS320F28335, TMS320F28334, TMS320F28332  
TMS320F28235, TMS320F28234, TMS320F28232  
SPRS439IJUNE 2007REVISED MARCH 2011  
www.ti.com  
Predictions show that prototype devices (TMX or TMP) have a greater failure rate than the standard  
production devices. Texas Instruments recommends that these devices not be used in any production  
system because their expected end-use failure rate still is undefined. Only qualified production devices are  
to be used.  
TI device nomenclature also includes a suffix with the device family name. This suffix indicates the  
package type (for example, ZJZ) and temperature range (for example, A). Figure 5-1 provides a legend for  
reading the complete device name for any family member.  
TMS 320  
F
28335 ZJZ  
A
PREFIX  
TEMPERATURE RANGE  
A = −40°C to 85°C  
S = −40°C to 125°C  
experimental device  
prototype device  
qualified device  
TMX =  
TMP =  
TMS =  
Q = −40°C to 125°C (Q100 qualification)  
DEVICE FAMILY  
PACKAGE TYPE  
PGF = 176-pin LQFP  
PTP = 176-pin PowerPADTM LQFP  
320 = TMS320 DSP Family  
ZHH = 179-ball MicroStar BGATM (Lead-free)  
ZJZ = 176-ball PBGA (Lead-free)  
TECHNOLOGY  
F = Flash EEPROM (1.9-V Core/3.3-V I/O)  
DEVICE  
28335  
28334  
28332  
28235  
28234  
28232  
BGA = Ball Grid Array  
PBGA = Plastic Ball Grid Array  
LQFP = Low-Profile Quad Flatpack  
PowerPAD and MicroStar BGA are trademarks of Texas Instruments.  
Figure 5-1. Example of F2833x, F2823x Device Nomenclature  
110  
Device Support  
Copyright © 2007–2011, Texas Instruments Incorporated  
Submit Documentation Feedback  
Product Folder Link(s): TMS320F28335 TMS320F28334 TMS320F28332 TMS320F28235 TMS320F28234  
TMS320F28232