TMS320F28335, TMS320F28334, TMS320F28332
TMS320F28235, TMS320F28234, TMS320F28232
SPRS439I–JUNE 2007–REVISED MARCH 2011
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8
Thermal/Mechanical Data
Table 8-1, Table 8-2, Table 8-3, and Table 8-4 show the thermal data. See Section 6.4.3 for more
information on thermal design considerations.
The mechanical package diagram(s) that follow the tables reflect the most current released mechanical
data available for the designated device(s).
Table 8-1. Thermal Model 176-Pin PGF Results
AIR FLOW
PARAMETER
0 lfm
44
150 lfm
34.5
250 lfm
33
500 lfm
31
θJA[°C/W] High k PCB
ΨJT[°C/W]
ΨJB
0.12
28.1
8.2
0.48
0.57
25.9
0.74
25.2
26.3
θJC
θJB
28.1
Table 8-2. Thermal Model 176-Pin PTP Results
AIR FLOW
PARAMETER
0 lfm
17.4
0.2
150 lfm
11.7
0.3
250 lfm
10.1
0.4
500 lfm
8.8
θJA[°C/W] High k PCB
ΨJT[°C/W]
ΨJB
0.5
5.0
4.7
4.7
4.6
θJC
12.1
5.1
θJB
Table 8-3. Thermal Model 179-Ball ZHH Results
AIR FLOW
PARAMETER
0 lfm
32.8
0.09
12.4
8.8
150 lfm
24.1
250 lfm
22.9
500 lfm
20.9
θJA[°C/W] High k PCB
ΨJT[°C/W]
ΨJB
0.3
0.36
0.48
11.8
11.7
11.5
θJC
θJB
12.5
184
Thermal/Mechanical Data
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