ꢀ ꢁ ꢂ ꢃ ꢄꢅ ꢆ ꢇ ꢄꢈꢈ ꢉ ꢀꢁ ꢂꢃ ꢄ ꢅ ꢆꢇ ꢄ ꢈꢈ ꢊ
ꢋ ꢌ ꢍꢎꢏ ꢐꢑ ꢒꢌ ꢓ ꢀ ꢏ ꢌ ꢔꢌ ꢀꢕꢖ ꢂ ꢌ ꢔꢓ ꢕꢖ ꢑ ꢗꢒ ꢆꢎꢂ ꢂꢒ ꢗꢂ
SPRS073L − AUGUST 1998 − REVISED JUNE 2005
device and development-support tool nomenclature (continued)
(
)
TMS 320
C
6211 GFN
167
PREFIX
DEVICE SPEED RANGE
TMX= Experimental device
TMP= Prototype device
100 MHz
120 MHz
150 MHz
167 MHz
200 MHz
233 MHz
250 MHz
300 MHz
TMS= Qualified device
SMJ = MIL-PRF-38535, QML
SM = High Rel (non-38535)
TEMPERATURE RANGE (DEFAULT: 0°C TO 90°C)
Blank = 0°C to 90°C, commercial temperature
A
= −40°C to 105°C, extended temperature
DEVICE FAMILY
32 or 320 = TMS320 DSP family
†‡
PACKAGE TYPE
GDP = 272-pin plastic BGA
GFN = 256-pin plastic BGA
TECHNOLOGY
GGP = 352-pin plastic BGA
C = CMOS
GJC = 352-pin plastic BGA
GJL = 352-pin plastic BGA
GLS = 384-pin plastic BGA
GLW = 340-pin plastic BGA
GNY = 384-pin plastic BGA
GNZ = 352-pin plastic BGA
GLZ = 532-pin plastic BGA
GHK = 288-pin plastic MicroStar BGAt
PYP = 208-pin PowerPADt plastic QFP
ZFN = 256-pin plastic BGA, with Pb-free soldered balls
§
DEVICE
C6000 DSPs:
C6201
C6211B DM641 C6712
C6202
C6411
DM642 C6712C
C6202B C6412
C6203B C6414
C6204
C6205
C6211
C6701
C6711
C6712D
C6713
C6415
C6416
C6711B C6713B
C6711C
DM640 C6711D
†
BGA
QFP
=
=
Ball Grid Array
Quad Flatpack
‡
§
The ZFN mechanical package designator represents the version of the GFN with Pb−Free soldered balls.
For actual device part numbers (P/Ns) and ordering information, see the Mechanical Data section of this
document or the TI website (www.ti.com).
Figure 4. TMS320C6000 DSP Device Nomenclature (Including the TMS320C6211
and TMS320C6211B Devices)
MicroStar BGA is a trademark of Texas Instruments.
32
POST OFFICE BOX 1443 • HOUSTON, TEXAS 77251−1443
TI [ TEXAS INSTRUMENTS ]
