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TMP75AIDGKRG4 参数 Datasheet PDF下载

TMP75AIDGKRG4图片预览
型号: TMP75AIDGKRG4
PDF下载: 下载PDF文件 查看货源
内容描述: 数字温度传感器,具有双线接口 [Digital Temperature Sensor with Two-Wire Interface]
分类和应用: 传感器换能器温度传感器输出元件
文件页数/大小: 20 页 / 640 K
品牌: TI [ TEXAS INSTRUMENTS ]
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TMP175
TMP75
www.ti.com
SBOS288J − JANUARY 2004 − REVISED DECEMBER 2007
ABSOLUTE MAXIMUM RATINGS
(1)
Power Supply, V+ . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7.0V
Input Voltage(2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . −0.5V to 7.0V
Input Current . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10mA
Operating Temperature Range . . . . . . . . . . . . . . . −55°C to +127°C
Storage Temperature Range . . . . . . . . . . . . . . . . . −60°C to +130°C
Junction Temperature (TJ max) . . . . . . . . . . . . . . . . . . . . . . +150°C
ESD Rating:
Human Body Model (HBM) . . . . . . . . . . . . . . . . . . . . . . . 4000V
Charged Device Model (CDM) . . . . . . . . . . . . . . . . . . . . 1000V
Machine Model (MM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 300V
(1) Stresses above these ratings may cause permanent damage.
Exposure to absolute maximum conditions for extended periods
may degrade device reliability. These are stress ratings only, and
functional operation of the device at these or any other conditions
beyond those specified is not supported.
(2) Input voltage rating applies to all TMP175 and TMP75 input
voltages.
This integrated circuit can be damaged by ESD. Texas
Instruments recommends that all integrated circuits be
handled with appropriate precautions. Failure to observe
proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to
complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could
cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT
TMP175
TMP175
TMP75
TMP75
at www.ti.com.
PACKAGE-LEAD
SO-8
MSOP-8
SO-8
MSOP-8
PACKAGE DESIGNATOR
D
DGK
D
DGK
PACKAGE MARKING
TMP175
DABQ
TMP75
T127
(1) For the most current package and ordering information, see the Package Option Addendum at the end of this document, or see the TI website
PIN ASSIGNMENTS
Top View
TMP175
TMP175
8
7
6
5
V+
A0
A1
A2
SDA
SCL
ALERT
GND
1
2
3
4
8
7
6
5
MSOP−8
V+
A0
A1
A2
SDA
SCL
ALERT
GND
1
2
3
4
TMP75
TMP75
8
7
6
5
V+
A0
A1
A2
SDA
SCL
ALERT
GND
1
8
V+
A0
A1
A2
TMP175
SO−8
TMP75
SDA
SCL
ALERT
GND
1
2
3
4
NOTE: Pin 1 is determined by orienting the package marking as indicated in the diagram.
DABQ
T127
2
3
4
7
6
5
SO−8
MSOP−8
2