TMP451
SBOS686 –JUNE 2013
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
PACKAGE AND ORDERING INFORMATION(1)
TWO-WIRE
PRODUCT
DESCRIPTION
ADDRESS
Single Channel
Remote Junction
Temperature Sensor
TMP451
1001 100
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
Over operating free-air temperature range, unless otherwise noted.
VALUE
–0.3 to +3.6
–0.3 to +3.6
–0.3 to (V+) + 0.3
–0.3 to +0.3
10
UNIT
V
Power supply, V+
Input voltage
Pins 4, 6, 7, and 8 only
Pin 2 only
V
V
Pin 3 only
V
Input current
mA
°C
°C
°C
V
Operating temperature range
Storage temperature range
Junction temperature (TJ max)
–55 to +127
–60 to +150
+150
Human body model (HBM)
3000
Electrostatic
discharge (ESD) Charged device model (CDM)
1000
V
ratings
Machine model (MM)
200
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
THERMAL INFORMATION
TMP451
THERMAL METRIC(1)
DQF (DFN)
8 PINS
171.3
81.4
UNITS
θJA
Junction-to-ambient thermal resistance
θJCtop
θJB
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
137.9
3.9
°C/W
ψJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
ψJB
140
θJCbot
N/A
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
2
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