TLV2371-Q1, TLV2372-Q1, TLV2374-Q1
FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS
SGLS244A − MAY 2004 − REVISED JUNE 2008
APPLICATION INFORMATION
general power dissipation considerations
For a given θ , the maximum power dissipation is shown in Figure 32 and is calculated by the following formula:
JA
T
–T
MAX
A
P
+
ǒ Ǔ
D
q
JA
Where:
P
T
= Maximum power dissipation of TLV237x IC (watts)
= Absolute maximum junction temperature (150°C)
= Free-ambient air temperature (°C)
= θ + θ
D
MAX
T
A
θ
JA
JC
CA
θ
θ
= Thermal coefficient from junction to case
JC
= Thermal coefficient from case to ambient air (°C/W)
CA
MAXIMUM POWER DISSIPATION
vs
FREE-AIR TEMPERATURE
2
T
J
= 150°C
PDIP Package
Low-K Test PCB
1.75
θ
JA
= 104°C/W
1.5
1.25
1
MSOP Package
Low-K Test PCB
SOIC Package
Low-K Test PCB
θ
JA
= 260°C/W
θ
JA
= 176°C/W
0.75
0.5
SOT-23 Package
Low-K Test PCB
0.25
0
θ
JA
= 324°C/W
−55−40 −25 −10
5
20 35 50 65 80 95 110 125
T
A
− Free-Air Temperature − °C
NOTE A: Results are with no air flow and using JEDEC Standard Low-K test PCB.
Figure 32.
16
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