TLV2371-Q1, TLV2372-Q1, TLV2374-Q1
FAMILY OF 550-μA/Ch 3-MHz RAIL-TO-RAIL INPUT/OUTPUT
OPERATIONAL AMPLIFIERS
SGLS244A − MAY 2004 − REVISED JUNE 2008
APPLICATION INFORMATION
circuit layout considerations
To achieve the levels of high performance of the TLV237x, follow proper printed-circuit board design techniques.
The following is a general set of guidelines.
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Ground planes—It is highly recommended that a ground plane be used on the board to provide all
components with a low inductive ground connection. However, in the areas of the amplifier inputs and
output, the ground plane can be removed to minimize the stray capacitance.
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Proper power supply decoupling—Use a 6.8-μF tantalum capacitor in parallel with a 0.1-μF ceramic
capacitor on each supply terminal. It may be possible to share the tantalum capacitor among several
amplifiers depending on the application, but a 0.1-μF ceramic capacitor should always be used on the
supply terminal of every amplifier. In addition, the 0.1-μF capacitor should be placed as close as possible
to the supply terminal. As this distance increases, the inductance in the connecting trace makes the
capacitor less effective. The designer should strive for distances of less than 0.1 inches between the device
power terminals and the ceramic capacitors.
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Sockets—Sockets can be used but are not recommended. The additional lead inductance in the socket pins
often leads to stability problems. Surface-mount packages soldered directly to the printed-circuit board is
the best implementation.
Short trace runs/compact part placements—Optimum high performance is achieved when stray series
inductance has been minimized. To realize this, the circuit layout should be made as compact as possible,
thereby minimizing the length of all trace runs. Particular attention should be paid to the inverting input of
the amplifier. Its length should be kept as short as possible. This helps to minimize stray capacitance at the
input of the amplifier.
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Surface-mount passive components—Using surface-mount passive components is recommended for high
performance amplifier circuits for several reasons. First, because of the extremely low lead inductance of
surface-mount components, the problem with stray series inductance is greatly reduced. Second, the small
size of surface-mount components naturally leads to a more compact layout thereby minimizing both stray
inductance and capacitance. If leaded components are used, it is recommended that the lead lengths be
kept as short as possible.
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