PACKAGE MATERIALS INFORMATION
www.ti.com
3-Oct-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLC7725QPWR
TLC7733IDR
TSSOP
SOIC
PW
D
8
8
8
8
8
8
8
2000
2500
2500
2000
2500
2500
2000
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
TLC7733IDR
SOIC
D
TLC7733IPWR
TLC7733QDR
TLC7733QDR
TLC7733QPWR
TSSOP
SOIC
PW
D
SOIC
D
TSSOP
PW
Pack Materials-Page 3