PACKAGE MATERIALS INFORMATION
www.ti.com
3-Oct-2013
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
TLC7733QDR
TLC7733QDR
TLC7733QPWR
SOIC
SOIC
D
D
8
8
8
2500
2500
2000
330.0
330.0
330.0
12.4
12.4
12.4
6.4
6.4
7.0
5.2
5.2
3.6
2.1
2.1
1.6
8.0
8.0
8.0
12.0
12.0
12.0
Q1
Q1
Q1
TSSOP
PW
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
TLC7701IDR
TLC7701IDRBT-NM
TLC7701IPWR
TLC7701QDR
TLC7701QPWR
TLC7703IDR
SOIC
SON
D
DRB
PW
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
250
367.0
210.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
TSSOP
SOIC
2000
2500
2000
2500
2000
2500
2000
2500
2000
2500
2000
2500
TSSOP
SOIC
PW
D
TLC7703IPWR
TLC7705IDR
TSSOP
SOIC
PW
D
TLC7705IPWR
TLC7705QDR
TLC7705QPWR
TLC7725IDR
TSSOP
SOIC
PW
D
TSSOP
SOIC
PW
D
TLC7725IPWR
TLC7725QDR
TSSOP
SOIC
PW
D
Pack Materials-Page 2