TLC7226C, TLC7226I, TLC7226M
QUADRUPLE 8 BIT DIGITAL TO ANALOG CONVERTERS
SLAS060E – JANUARY 1995 – REVISED JANUARY 2003
features
D
D
D
D
D
DW OR N PACKAGE
(TOP VIEW)
Four 8-Bit D/A Converters
Microprocessor Compatible
TTL/CMOS Compatible
Single Supply Operation Possible
CMOS Technology
applications
D
Process Control
D
Automatic Test Equipment
D
Automatic Calibration of Large System
Parameters, e.g. Gain/Offset
OUTB
OUTA
V
SS
REF
AGND
DGND
DB7
DB6
DB5
DB4
1
2
3
4
5
6
7
8
9
10
20
19
18
17
16
15
14
13
12
11
OUTC
OUTD
V
DD
A0
A1
WR
DB0
DB1
DB2
DB3
description
The TLC7226C, TLC7226I, and TLC7226M
consist of four 8-bit voltage-output digital-to-
analog converters (DACs) with output buffer
amplifiers and interface logic on a single
monolithic chip.
Separate on-chip latches are provided for each of
the four DACs. Data is transferred into one of
these data latches through a common 8-bit
TTL/CMOS-compatible 5-V input port. Control
inputs A0 and A1 determine which DAC is loaded
when WR goes low. The control logic is speed
compatible with most 8-bit microprocessors.
Each DAC includes an output buffer amplifier
capable of sourcing up to 5 mA of output current.
FK PACKAGE
(TOP VIEW)
OUTC
DB2
3
2
1
20 19
18
V
DD
17
A0
16
A1
15
WR
14
DB0
REF
AGND
DGND
DB7
DB6
4
5
6
7
8
9
10 11 12 13
DB5
DB4
DB3
The TLC7226 performance is specified for input reference voltages from 2 V to V
DD
– 4 V with dual supplies.
The voltage mode configuration of the DACs allows the TLC7226 to be operated from a single power supply
rail at a reference of 10 V.
The TLC7226 is fabricated in a LinBiCMOS process that has been specifically developed to allow high-speed
digital logic circuits and precision analog circuits to be integrated on the same chip. The TLC7226 has a common
8-bit data bus with individual DAC latches. This provides a versatile control architecture for simple interface to
microprocessors. All latch-enable signals are level triggered.
Combining four DACs, four operational amplifiers, and interface logic into either a 0.3-inch wide, 20-terminal
dual-in-line IC (DIP) or a small 20-terminal small-outline IC (SOIC) allows a dramatic reduction in board space
requirements and offers increased reliability in systems using multiple converters. The Leadless Ceramic Chip
Carrier (LCCC) package provides for operation at military temperature range. The pinout is aimed at optimizing
board layout with all of the analog inputs and outputs at one end of the package and all of the digital inputs at
the other.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
LinBiCMOS is a trademark of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2003, Texas Instruments Incorporated
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
DB1
OUTD
OUTB
OUTA
V
SS
1
TI [ TEXAS INSTRUMENTS ]
