TLC5970
www.ti.com
SBVS140 –MARCH 2010
THERMAL INFORMATION
TLC5970
RHP
28
THERMAL METRIC(1)
UNITS
qJA
Junction-to-ambient thermal resistance(2)
Junction-to-case(top) thermal resistance
26.7
11.7
5.3
(3)
qJC(top)
qJB
(4)
Junction-to-board thermal resistance
°C/W
(5)
yJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
0.4
(6)
(7)
yJB
5.2
qJC(bottom)
Junction-to-case(bottom) thermal resistance
1.6
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, High-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
(3) The junction-to-case(top) thermal resistance is obtained by simulating a cold plate test on the package top. No specific JEDEC-standard
test exists, but a close description can be found in the ANSI SEMI standard G30-88.
(4) The junction-to-board thermal resistance is obtained by simulating in an environment with a ring cold plate fixture to control the PCB
temperature, as described in JESD51-8.
(5) The junction-to-top characterization parameter, yJT, estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA, using a procedure described in JESD51-2a (sections 6 and 7).
(6) The junction-to-board characterization parameter, yJB estimates the junction temperature of a device in a real system and is extracted
from the simulation data for obtaining qJA , using a procedure described in JESD51-2a (sections 6 and 7).
(7) The junction-to-case(bottom) thermal resistance is obtained by simulating a cold plate test on the exposed (power) pad. No specific
JEDEC standard test exists, but a close description can be found in the ANSI SEMI standard G30-88.
DISSIPATION RATINGS
DERATING FACTOR
ABOVE TA = +25°C
POWER RATING
TA < +25°C
POWER RATING
TA = +70°C
POWER RATING
TA = +85°C
PACKAGE
HTSSOP-32
42.5 mW/°C
22.5 mW/°C
33.2 mW/°C
5318 mW
2820 mW
4149 mW
3403 mW
1805 mW
2655 mW
2765 mW
1466 mW
2157 mW
with PowerPAD soldered(1)(2)
HTSSOP-32
with PowerPAD unsoldered(2)(3)
QFN-28
bottom side heat sink soldered(4)
(1) With PowerPAD soldered onto copper area on printed circuit board (PCB); 2-oz. copper. For more information, see application report
SLMA002, PowerPAD Thermally-Enhanced Package (available for download at www.ti.com).
(2) Product preview device.
(3) With PowerPAD not soldered onto copper area on PCB.
(4) The package thermal impedance is calculated in accordance with JESD51-5.
Copyright © 2010, Texas Instruments Incorporated
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