SLOS190G − FEBRUARY 1997 − REVISED MAY 2004
TLC227x, TLC227xA
Advanced LinCMOS RAIL TO RAIL
OPERATIONAL AMPLIFIERS
TLC2272 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
At 25°C
950
µV
2.5 mV
950
µV
2.5 mV
−40°C to 125°C
950
µV
2.5 mV
950
µV
2.5 mV
SMALL
OUTLINE†
(D)
TLC2272ACD
TLC2272CD
TLC2272AID
TLC2272ID
TLC2272AQD
TLC2272QD
TLC2272AMD
TLC2272MD
CERAMIC
LCC
(FK)
—
—
—
—
—
—
TLC2272AMFK
TLC2272MFK
CERAMIC
DIP
(JG)
—
—
—
—
—
—
TLC2272AMJG
TLC2272MJG
PLASTIC DIP
(P)
TLC2272ACP
TLC2272CP
TLC2272AIP
TLC2272IP
—
TLC2272AMP
TLC2272MP
TSSOP‡
(PW)
TLC2272ACPW
TLC2272CPW
—
TLC2272IPW
TLC2272AQPW
TLC2272QPW
—
CERAMIC
FLAT PACK
(U)
—
—
—
—
—
—
TLC2272AMU
TLC2272MU
0°C to 70°C
−55°C to 125°C
† The D packages are available taped and reeled. Add R suffix to the device type (e.g., TLC2272CDR).
‡ The PW package is available taped and reeled. Add R suffix to the device type (e.g., TLC2272PWR).
§ Chips are tested at 25°C.
TLC2274 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
950
µV
2.5 mV
950
µV
2.5 mV
−40°C to 125°C
950
µV
2.5 mV
950
µV
2.5 mV
SMALL
OUTLINE†
(D)
TLC2274ACD
TLC2274CD
TLC2274AID
TLC2274ID
TLC2274AQD
TLC2274QD
TLC2274AMD
TLC2274MD
CERAMIC
LCC
(FK)
—
—
—
TLC2274AMFK
TLC2274MFK
CERAMIC
DIP
(J)
—
—
—
TLC2274AMJ
TLC2274MJ
PLASTIC
DIP
(N)
TLC2274ACN
TLC2274CN
TLC2274AIN
TLC2274IN
—
TLC2274AMN
TLC2274MN
TSSOP‡
(PW)
TLC2274ACPW
TLC2274CPW
TLC2274AIPW
TLC2274IPW
—
—
CERAMIC
FLAT PACK
(W)
—
—
—
TLC2274AMW
TLC2274MW
0°C to 70°C
−55°C to 125°C
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLC2274CDR).
‡ The PW package is available taped and reeled.
§ Chips are tested at 25°C.
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
TI [ TEXAS INSTRUMENTS ]
