TL084Y
JFET-INPUT QUAD OPERATIONAL AMPLIFIER
SLOS081A–D2297, FEBRUARY 1977–REVISED NOVEMBER 1992
chip information
These chips, when properly assembled, display characteristics similar to the TL084. Thermal compression or
ultrasonic bonding may be used on the doped aluminum bonding pads. Chips may be mounted with conductive
epoxy or a gold-silicon preform.
BONDING PAD ASSIGNMENTS
V
CC+
(4)
(3)
(2)
1 IN+
1 IN–
+
–
(1)
1 OUT
(5)
(6)
+
–
2 IN+
2 IN–
(7)
2 OUT
3 IN+
(10)
(9)
+
–
(8)
3 OUT
3 IN–
(12)
(13)
+
4 IN+
4 IN–
(14)
4 OUT
–
(11)
V
CC–
CHIP THICKNESS: 15 TYPICAL
BONDING PADS: 4 × 4 MINIMUM
T max = 150°C
J
TOLERANCES ARE ±10%
ALL DIMENSIONS ARE IN MILS
PIN (11) INTERNALLY CONNECTED
TO BACKSIDE OF CHIP
5
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
POST OFFICE BOX 1443 • HOUSTON, TEXAS
77251–1443
TI [ TEXAS INSTRUMENTS ]
