PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
Status (1)
Package Package
Pins Package Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
Qty
Type
Drawing
5962-9681001QXA
ACTIVE
ACTIVE
CFP
WD
48
48
1
TBD
A42 SNPB
N / A for Pkg Type
74LVTH16373DGGRG4
TSSOP
DGG
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
74LVTH16373DLRG4
SN74LVTH16373DGGR
SN74LVTH16373DL
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
SSOP
TSSOP
SSOP
SSOP
SSOP
DL
DGG
DL
48
48
48
48
48
56
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
2000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
SN74LVTH16373DLG4
SN74LVTH16373DLR
SN74LVTH16373GQLR
DL
25 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
DL
1000 Green (RoHS & CU NIPDAU Level-1-260C-UNLIM
no Sb/Br)
BGA MI
CROSTA
R JUNI
OR
GQL
1000
TBD
SNPB
Level-1-240C-UNLIM
Level-1-240C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
N / A for Pkg Type
SN74LVTH16373GRDR
SN74LVTH16373ZQLR
SN74LVTH16373ZRDR
SNJ54LVTH16373WD
ACTIVE
ACTIVE
ACTIVE
ACTIVE
BGA MI
CROSTA
R JUNI
OR
GRD
ZQL
ZRD
WD
54
56
54
48
1000
TBD
SNPB
BGA MI
CROSTA
R JUNI
OR
1000 Green (RoHS &
no Sb/Br)
SNAGCU
SNAGCU
A42 SNPB
BGA MI
CROSTA
R JUNI
OR
1000 Green (RoHS &
no Sb/Br)
CFP
1
TBD
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1
TI [ TEXAS INSTRUMENTS ]
