PACKAGE OPTION ADDENDUM
www.ti.com
6-Dec-2006
PACKAGING INFORMATION
Orderable Device
5962-9681001QXA
74LVTH16373DGGRG4
74LVTH16373DLRG4
SN74LVTH16373DGGR
SN74LVTH16373DL
SN74LVTH16373DLG4
SN74LVTH16373DLR
SN74LVTH16373GQLR
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
CFP
TSSOP
SSOP
TSSOP
SSOP
SSOP
SSOP
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
BGA MI
CROSTA
R JUNI
OR
CFP
Package
Drawing
WD
DGG
DL
DGG
DL
DL
DL
GQL
Pins Package Eco Plan
(2)
Qty
48
48
48
48
48
48
48
56
1
TBD
2000 Green (RoHS &
no Sb/Br)
1000 Green (RoHS &
no Sb/Br)
2000 Green (RoHS &
no Sb/Br)
25
25
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
A42 SNPB
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
SNPB
MSL Peak Temp
(3)
N / A for Pkg Type
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-240C-UNLIM
1000 Green (RoHS &
no Sb/Br)
1000
TBD
SN74LVTH16373GRDR
ACTIVE
GRD
54
1000
TBD
SNPB
Level-1-240C-UNLIM
SN74LVTH16373ZQLR
ACTIVE
ZQL
56
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SN74LVTH16373ZRDR
ACTIVE
ZRD
54
1000 Green (RoHS &
no Sb/Br)
SNAGCU
Level-1-260C-UNLIM
SNJ54LVTH16373WD
(1)
ACTIVE
WD
48
1
TBD
A42 SNPB
N / A for Pkg Type
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Addendum-Page 1