SN74LVC2G74
SINGLE POSITIVE-EDGE-TRIGGERED D-TYPE FLIP-FLOP
WITH CLEAR AND PRESET
www.ti.com
SCES203K – APRIL 1999 – REVISED JUNE 2005
FEATURES
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Available in the Texas Instruments
NanoStar™ and NanoFree™ Packages
Supports 5-V V
CC
Operation
Inputs Accept Voltages to 5.5 V
Max t
pd
of 5.9 ns at 3.3 V
Low Power Consumption, 10-µA Max I
CC
±24-mA
Output Drive at 3.3 V
Typical V
OLP
(Output Ground Bounce)
<0.8 V at V
CC
= 3.3 V, T
A
= 25°C
Typical V
OHV
(Output V
OH
Undershoot)
>2 V at V
CC
= 3.3 V, T
A
= 25°C
I
off
Supports Partial-Power-Down Mode
Operation
Latch-Up Performance Exceeds 100 mA Per
JESD 78, Class II
ESD Protection Exceeds JESD 22
– 2000-V Human-Body Model (A114-A)
– 200-V Machine Model (A115-A)
– 1000-V Charged-Device Model (C101)
DCT OR DCU PACKAGE
(TOP VIEW)
CLK
D
Q
GND
1
2
3
4
8
7
6
5
V
CC
PRE
CLR
Q
YEA, YEP, YZA, OR YZP PACKAGE
(BOTTOM VIEW)
GND
Q
D
CLK
4 5
3 6
2 7
1 8
Q
CLR
PRE
V
CC
DESCRIPTION/ORDERING INFORMATION
This single positive-edge-triggered D-type flip-flop is designed for 1.65-V to 5.5-V V
CC
operation.
NanoStar™ and NanoFree™ package technology is a major breakthrough in IC packaging concepts, using the
die as the package.
ORDERING INFORMATION
T
A
NanoStar™
WCSP (DSBGA) – YEA
NanoFree™
WCSP (DSBGA) – YZA (Pb-free)
–40°C to 85°C
NanoStar™ – WCSP (DSBGA)
0.23-mm Large Bump – YEP
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
SSOP – DCT
VSSOP – DCU
(1)
(2)
Reel of 3000
Reel of 3000
Reel of 250
PACKAGE
(1)
ORDERABLE PART NUMBER
SN74LVC2G74YEAR
SN74LVC2G74YZAR
Reel of 3000
SN74LVC2G74YEPR
SN74LVC2G74YZPR
SN74LVC2G74DCTR
SN74LVC2G74DCUR
SN74LVC2G74DCUT
C74_ _ _
C74_
_ _ _CP_
TOP-SIDE MARKING
(2)
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DCT: The actual top-side marking has three additional characters that designate the year, month, and assembly/test site.
DCU: The actual top-side marking has one additional character that designates the assembly/test site.
YEA/YZA, YEP/YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one
following character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas
Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
NanoStar, NanoFree are trademarks of Texas Instruments.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
Copyright © 1999–2005, Texas Instruments Incorporated
TI [ TEXAS INSTRUMENTS ]
