SINGLE BUFFER/DRIVER
WITH OPEN-DRAIN OUTPUT
SCES296V – FEBRUARY 2000 – REVISED FEBRUARY 2007
www.ti.com
ORDERING INFORMATION
T
A
PACKAGE
(1)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZP (Pb-free)
NanoFree™ – WCSP (DSBGA)
0.23-mm Large Bump – YZV (Pb-free)
SON – DRY
–40 C to 85 C
SOT (SOT-23) – DBV
SOT (SC-70) – DCK
SOT (SOT-553) – DRL
(1)
(2)
Reel of 3000
Reel of 250
Reel of 3000
Reel of 250
Reel of 4000
Reel of 3000
Reel of 3000
Reel of 5000
ORDERABLE
PART NUMBER
SN74LVC1G07YZPR
SN74LVC1G07YZVR
SN74LVC1G07DRYR
SN74LVC1G07DRYRG4
SN74LVC1G07DBVR
SN74LVC1G07DBVT
SN74LVC1G07DCKR
SN74LVC1G07DCKT
SN74LVC1G07DRLR
TOP-SIDE
MARKING
(2)
_ _ _CV_
____
CV
CV_
C07_
CV_
CV_
Package drawings, standard packing quantities, thermal data, symbolization, and PCB design guidelines are available at
www.ti.com/sc/package.
DBV/DCK/DRL/DRY: The actual top-side marking has one additional character that designates the assembly/test site.
YZP: The actual top-side marking has three preceding characters to denote year, month, and sequence code, and one following
character to designate the assembly/test site. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
YZV: The actual top-side marking is on two lines. Line 1 has four characters to denote year, month, day, and assembly/test site. Line 2
has two characters which show the family and function code. Pin 1 identifier indicates solder-bump composition (1 = SnPb,
•
= Pb-free).
FUNCTION TABLE
INPUT
A
H
L
OUTPUT
Y
H
L
LOGIC DIAGRAM (POSITIVE LOGIC)
(DBV, DCK, DRL, DRY, and YZP Package)
A
2
4
Y
LOGIC DIAGRAM (POSITIVE LOGIC)
(YZV Package)
A
1
3
Y
2
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