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SN74AHCT1G08DBVR 参数 Datasheet PDF下载

SN74AHCT1G08DBVR图片预览
型号: SN74AHCT1G08DBVR
PDF下载: 下载PDF文件 查看货源
内容描述: 单路2输入正与门 [SINGLE 2-INPUT POSITIVE-AND GATE]
分类和应用: 栅极触发器逻辑集成电路光电二极管输入元件PC
文件页数/大小: 13 页 / 572 K
品牌: TI [ TEXAS INSTRUMENTS ]
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PACKAGE OPTION ADDENDUM
www.ti.com
22-Oct-2007
PACKAGING INFORMATION
Orderable Device
74AHCT1G08DBVRE4
74AHCT1G08DBVRG4
74AHCT1G08DBVTE4
74AHCT1G08DBVTG4
74AHCT1G08DCKRE4
74AHCT1G08DCKRG4
74AHCT1G08DCKTE4
74AHCT1G08DCKTG4
74AHCT1G08DRLRG4
SN74AHCT1G08DBVR
SN74AHCT1G08DBVT
SN74AHCT1G08DCKR
SN74AHCT1G08DCKT
SN74AHCT1G08DRLR
(1)
Status
(1)
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
Package
Type
SOT-23
SOT-23
SOT-23
SOT-23
SC70
SC70
SC70
SC70
SOT
SOT-23
SOT-23
SC70
SC70
SOT
Package
Drawing
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
DRL
DBV
DBV
DCK
DCK
DRL
Pins Package Eco Plan
(2)
Qty
5
5
5
5
5
5
5
5
5
5
5
5
5
5
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
250
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
Lead/Ball Finish
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
CU NIPDAU
MSL Peak Temp
(3)
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
Level-1-260C-UNLIM
3000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
250
Green (RoHS &
no Sb/Br)
Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
3000 Green (RoHS &
no Sb/Br)
250
Green (RoHS &
no Sb/Br)
4000 Green (RoHS &
no Sb/Br)
The marketing status values are defined as follows:
ACTIVE:
Product device recommended for new designs.
LIFEBUY:
TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND:
Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW:
Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE:
TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
for the latest availability information and additional product content details.
TBD:
The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS):
TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt):
This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br):
TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3)
MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The
information provided on this page represents TI's knowledge and belief as of the date that it is
Addendum-Page 1