SPNS174
–
SEPTEMBER 2011
6 Mechanical Data
6.1
Thermal Data
shows the thermal resistance characteristics for the QFP - PGE mechanical package.
shows the thermal resistance characteristics for the BGA - ZWT mechanical package.
Table 6-1. Thermal Resistance Characteristics
(PGE Package)
PARAMETER
RΘ
JA
RΘ
JC
°C
/ W
45
5
Table 6-2. Thermal Resistance Characteristics
(ZWT Package)
PARAMETER
RΘ
JA
RΘ
JC
°C
/ W
7.1
18.8
6.2
Packaging Information
The following packaging information reflects the most current released data available for the designated
device(s). This data is subject to change without notice and without revision of this document.
Copyright
©
2011, Texas Instruments Incorporated
Mechanical Data
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