PACKAGE OPTION ADDENDUM
www.ti.com
11-Apr-2013
PACKAGING INFORMATION
Orderable Device
OPA548F
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
Top-Side Markings
Samples
Drawing
Qty
(1)
(2)
(3)
(4)
OBSOLETE DDPAK/
TO-263
KTW
7
7
7
7
7
7
7
7
7
TBD
Call TI
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
CU SN
Call TI
OPA548F/500
OPA548F/500G3
OPA548FKTWT
OPA548FKTWTG3
OPA548T
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
DDPAK/
TO-263
KTW
KTW
KTW
KTW
KVT
KC
500
500
50
Green (RoHS
& no Sb/Br)
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
Level-2-260C-1 YEAR
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
N / A for Pkg Type
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
-40 to 85
OPA548F
DDPAK/
TO-263
Green (RoHS
& no Sb/Br)
OPA548F
OPA548F
OPA548F
OPA548T
OPA548T
OPA548T
OPA548T
DDPAK/
TO-263
Green (RoHS
& no Sb/Br)
DDPAK/
TO-263
50
Green (RoHS
& no Sb/Br)
TO-220
TO-220
TO-220
TO-220
50
Green (RoHS
& no Sb/Br)
OPA548T-1
50
Green (RoHS
& no Sb/Br)
OPA548T-1G3
OPA548TG3
KC
50
Green (RoHS
& no Sb/Br)
KVT
50
Green (RoHS
& no Sb/Br)
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
Addendum-Page 1
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