SBOS426B – NOVEMBER 2008 – REVISED AUGUST 2010
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ELECTRICAL CHARACTERISTICS: V
S
= ±2.25V to ±18V (continued)
Boldface
limits apply over the specified temperature range,
T
A
= –40°C to +125°C.
At T
A
= +25°C, R
L
= 10kΩ connected to midsupply, and V
CM
= V
OUT
= midsupply, unless otherwise noted.
OPA209, OPA2209, OPA4209
PARAMETER
OUTPUT
Voltage Output Swing
R
L
= 10kΩ, A
OL
> 130dB
R
L
= 600Ω, A
OL
> 114dB
over Temperature
Short-Circuit Current
Capacitive Load Drive (stable operation)
Open-Loop Output Impedance
POWER SUPPLY
Specified Voltage
Quiescent Current (per amplifier)
over Temperature
TEMPERATURE RANGE
Specified Range
Operating Range
T
A
T
A
–40
–55
+125
+150
°C
°C
V
S
I
Q
I
O
= 0A
±2.25
2.2
±18
2.5
3.25
V
mA
mA
I
SC
C
LOAD
Z
O
R
L
= 10kΩ, A
OL
> 120dB
V
S
= ±18V
(V–) + 0.2V
(V–) + 0.6V
(V–) + 0.2V
±65
See
See
(V+) – 0.2V
(V+) – 0.6V
(V+) – 0.2V
V
V
V
mA
CONDITIONS
MIN
TYP
MAX
UNIT
THERMAL INFORMATION
OPA209AID
THERMAL METRIC
(1)
q
JA
q
JCtop
q
JB
y
JT
y
JB
q
JCbot
(1)
(2)
Junction-to-ambient thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
(2)
OPA209AIDBV
DBV
5
204.9
200
113.1
38.2
104.9
n/a
OPA209AIDGK
DGK
8
142.6
46.9
63.5
5.3
62.8
n/a
°C/W
UNITS
D
8
135.5
73.7
61.9
19.7
54.8
n/a
Junction-to-case (top) thermal resistance
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
THERMAL INFORMATION
OPA2209AID
THERMAL METRIC
q
JA
q
JCtop
q
JB
y
JT
y
JB
q
JCbot
(1)
(2)
(1)
OPA2209AIDGK
DGK
8
132.7
38.5
52.1
2.4
52.8
n/a
OPA4209AIPW
PW
14
112.9
26.1
61.0
0.7
59.2
n/a
°C/W
UNITS
D
8
(2)
Junction-to-ambient thermal resistance
Junction-to-board thermal resistance
134.3
72.1
60.7
18.2
53.8
n/a
Junction-to-case (top) thermal resistance
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
For more information about traditional and new thermal metrics, see the
IC Package Thermal Metrics
application report,
The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
4
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