SBOS426B – NOVEMBER 2008 – REVISED AUGUST 2010
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This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION
(1)
PRODUCT
OPA209
PACKAGE-LEAD
SOT23-5
MSOP-8
SO-8
OPA2209
OPA4209
(1)
MSOP-8
SO-8
TSSOP-14
PACKAGE DESIGNATOR
DBV
DGK
D
DGK
D
PW
PACKAGE MARKING
OOBQ
OOAQ
OPA209A
OOJI
O2209
OPA4209
For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at
ABSOLUTE MAXIMUM RATINGS
(1)
OPA209, OPA2209, OPA4209
Supply Voltage
Signal Input Terminal, Voltage
Output Short-Circuit
(3)
(2)
UNIT
V
V
mA
V
S
= (V+) – (V–)
40
(V–) – 0.5 to (V+) + 0.5
10
Continuous
Signal Input Terminal, Current (except power-supply pins)
(2)
Operating Temperature
Storage Temperature
Junction Temperature
ESD Ratings:
(1)
(2)
(3)
Human Body Model (HBM)
Charged Device Model (CDM)
T
A
T
A
T
J
–55 to +150
–65 to +150
+200
3000
1000
°C
°C
°C
V
V
Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
For input voltages beyond the power-supply rails, voltage or current must be limited.
Short-circuit to ground, one amplifier per package.
2
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