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OPA2180IDR 参数 Datasheet PDF下载

OPA2180IDR图片预览
型号: OPA2180IDR
PDF下载: 下载PDF文件 查看货源
内容描述: 0.1 μV / A ° Ç漂移,低噪声,轨到轨输出, 36 -V ,零漂移运算放大器 [0.1-μV/°C Drift, Low-Noise, Rail-to-Rail Output, 36-V, Zero-Drift OPERATIONAL AMPLIFIERS]
分类和应用: 运算放大器
文件页数/大小: 25 页 / 872 K
品牌: TI [ TEXAS INSTRUMENTS ]
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OPA2180  
OPA4180  
SBOS584B NOVEMBER 2011REVISED DECEMBER 2011  
www.ti.com  
ELECTRICAL CHARACTERISTICS: VS = ±2 V to ±18 V (VS = +4 V to +36 V) (continued)  
At TA = +25°C, RL = 10 kΩ connected to VS/2, and VCOM = VOUT = VS/2, unless otherwise noted.  
OPA2180, OPA4180  
PARAMETER  
CONDITIONS  
MIN  
TYP  
MAX  
UNIT  
OUTPUT  
No load  
8
250  
325  
±18  
120  
1
18  
300  
360  
mV  
mV  
mV  
mA  
Ω
Voltage output swing from rail  
RL = 10 kΩ  
TA = 40°C to +105°C, RL = 10 kΩ  
ISC  
Short-circuit current  
RO  
Open-loop output resistance  
Capacitive load drive  
f = 2 MHz, IO = 0 mA  
CLOAD  
nF  
POWER SUPPLY  
VS  
Operating voltage range  
±2 (or 4)  
±18 (or 36)  
525  
V
450  
μA  
μA  
IQ  
Quiescent current (per amplifier)  
TA = 40°C to +105°C, IO = 0 mA  
600  
TEMPERATURE  
Specified range  
40  
40  
65  
+105  
+125  
+150  
°C  
°C  
°C  
Operating range  
Storage range  
THERMAL INFORMATION: OPA2180  
OPA2180  
THERMAL METRIC(1)  
D (SO)  
8 PINS  
111.0  
54.9  
DGK (MSOP)  
8 PINS  
159.3  
37.4  
UNITS  
θJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
θJCtop  
θJB  
51.7  
48.5  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
9.3  
1.2  
ψJB  
51.1  
77.1  
θJCbot  
n/a  
n/a  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
THERMAL INFORMATION: OPA4180  
OPA4180  
THERMAL METRIC(1)  
D (SO)  
14 PINS  
TBD  
PW (TSSOP)  
14 PINS  
TBD  
UNITS  
θJA  
Junction-to-ambient thermal resistance  
Junction-to-case (top) thermal resistance  
Junction-to-board thermal resistance  
θJCtop  
θJB  
TBD  
TBD  
TBD  
TBD  
°C/W  
ψJT  
Junction-to-top characterization parameter  
Junction-to-board characterization parameter  
Junction-to-case (bottom) thermal resistance  
TBD  
TBD  
ψJB  
TBD  
TBD  
θJCbot  
TBD  
TBD  
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.  
4
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Copyright © 2011, Texas Instruments Incorporated  
Product Folder Link(s): OPA2180 OPA4180  
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