OPA209
OPA2209
OPA4209
SBOS426B –NOVEMBER 2008–REVISED AUGUST 2010
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ELECTRICAL CHARACTERISTICS: VS = ±2.25V to ±18V (continued)
Boldface limits apply over the specified temperature range, TA = –40°C to +125°C.
At TA = +25°C, RL = 10kΩ connected to midsupply, and VCM = VOUT = midsupply, unless otherwise noted.
OPA209, OPA2209, OPA4209
PARAMETER
CONDITIONS
MIN
TYP
MAX
UNIT
OUTPUT
Voltage Output Swing
RL = 10kΩ, AOL > 130dB
RL = 600Ω, AOL > 114dB
RL = 10kΩ, AOL > 120dB
VS = ±18V
(V–) + 0.2V
(V–) + 0.6V
(V–) + 0.2V
(V+) – 0.2V
(V+) – 0.6V
(V+) – 0.2V
V
V
over Temperature
Short-Circuit Current
V
ISC
CLOAD
ZO
±65
mA
Capacitive Load Drive (stable operation)
Open-Loop Output Impedance
POWER SUPPLY
See Typical Characteristics
See Typical Characteristics
Specified Voltage
VS
IQ
±2.25
±18
V
Quiescent Current (per amplifier)
over Temperature
IO = 0A
2.2
2.5
mA
mA
3.25
TEMPERATURE RANGE
Specified Range
TA
TA
–40
–55
+125
+150
°C
°C
Operating Range
THERMAL INFORMATION
OPA209AID
OPA209AIDBV
OPA209AIDGK
THERMAL METRIC(1)
D
8
DBV
5
DGK
8
UNITS
qJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
Junction-to-top characterization parameter
135.5
73.7
61.9
19.7
204.9
200
142.6
46.9
63.5
5.3
qJCtop
qJB
113.1
38.2
104.9
n/a
°C/W
yJT
yJB
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
54.8
n/a
62.8
n/a
qJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
THERMAL INFORMATION
OPA2209AID
OPA2209AIDGK
OPA4209AIPW
THERMAL METRIC(1)
D
8
DGK
8
PW
14
UNITS
qJA
Junction-to-ambient thermal resistance(2)
Junction-to-case (top) thermal resistance
Junction-to-board thermal resistance
134.3
72.1
60.7
18.2
53.8
n/a
132.7
38.5
52.1
2.4
112.9
26.1
61.0
0.7
qJCtop
qJB
°C/W
yJT
Junction-to-top characterization parameter
Junction-to-board characterization parameter
Junction-to-case (bottom) thermal resistance
yJB
52.8
n/a
59.2
n/a
qJCbot
(1) For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953.
(2) The junction-to-ambient thermal resistance under natural convection is obtained in a simulation on a JEDEC-standard, high-K board, as
specified in JESD51-7, in an environment described in JESD51-2a.
4
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