OPA209
OPA2209
OPA4209
SBOS426B –NOVEMBER 2008–REVISED AUGUST 2010
www.ti.com
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with
appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more
susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.
ORDERING INFORMATION(1)
PRODUCT
PACKAGE-LEAD
SOT23-5
MSOP-8
SO-8
PACKAGE DESIGNATOR
PACKAGE MARKING
OOBQ
DBV
DGK
D
OPA209
OOAQ
OPA209A
OOJI
MSOP-8
SO-8
DGK
D
OPA2209
OPA4209
O2209
TSSOP-14
PW
OPA4209
(1) For the most current package and ordering information see the Package Option Addendum at the end of this document, or see the TI
web site at www.ti.com.
ABSOLUTE MAXIMUM RATINGS(1)
OPA209, OPA2209, OPA4209
UNIT
V
Supply Voltage
VS = (V+) – (V–)
40
(V–) – 0.5 to (V+) + 0.5
10
Signal Input Terminal, Voltage(2)
V
Signal Input Terminal, Current (except power-supply pins)(2)
Output Short-Circuit(3)
mA
Continuous
–55 to +150
–65 to +150
+200
Operating Temperature
TA
TA
TJ
°C
°C
°C
V
Storage Temperature
Junction Temperature
Human Body Model (HBM)
ESD Ratings:
3000
Charged Device Model (CDM)
1000
V
(1) Stresses above these ratings may cause permanent damage. Exposure to absolute maximum conditions for extended periods may
degrade device reliability. These are stress ratings only, and functional operation of the device at these or any other conditions beyond
those specified is not implied.
(2) For input voltages beyond the power-supply rails, voltage or current must be limited.
(3) Short-circuit to ground, one amplifier per package.
2
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Product Folder Link(s): OPA209 OPA2209 OPA4209
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