OMAP-L137 Low-Power Applications Processor
SPRS563A–SEPTEMBER 2008–REVISED OCTOBER 2008
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7 Mechanical Packaging and Orderable Information
This section describes the OMAP-L137 orderable part numbers, packaging options, materials, thermal and
mechanical parameters.
7.1 Thermal Data for ZKB
The following table(s) show the thermal resistance characteristics for the PBGA–ZKB mechanical
package.
Table 7-1. Thermal Resistance Characteristics (PBGA Package) [ZKB]
NO.
°C/W(1)
°C/W(2)
AIR FLOW
(m/s)(3)
1
2
RΘJC
RΘJB
RΘJA
Junction-to-case
Junction-to-board
Junction-to-free air
12.8
15.1
24.5
21.9
21.1
20.4
19.6
0.6
13.5
19.7
33.8
30
N/A
N/A
3
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
0.00
0.50
1.00
2.00
4.00
4
5
28.7
27.4
26
RΘJMA
Junction-to-moving air
6
7
8
0.8
9
0.8
1
10
11
12
13
14
15
16
17
PsiJT
Junction-to-package top
0.9
1.2
1.1
1.4
1.3
1.8
14.9
14.4
14.4
14.3
14.1
19.1
18.2
18
PsiJB
Junction-to-board
17.7
17.4
(1) These measurements were conducted in a JEDEC defined 2S2P system and will change based on environment as well as application.
For more information, see these EIA/JEDEC standards – EIA/JESD51-2, Integrated Circuits Thermal Test Method Environment
Conditions - Natural Convection (Still Air) and JESD51-7, High Effective Thermal Conductivity Test Board for Leaded Surface Mount
Packages. Power dissipation of 1W and ambient temp of 70C assumed. PCB with 2oz (70um) top and bottom copper thickness and
1.5oz (50um) inner copper thickness
(2) Simulation data, using the same model but with 1oz (35um) top and bottom copper thickness and 0.5oz (18um) inner copper thickness.
Power dissipation of 1W and ambient temp of 70C assumed.
(3) m/s = meters per second
7.2 Mechanical Drawings
This section contains mechanical drawings for the ZKB Ball Grid Array package .
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Mechanical Packaging and Orderable Information
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