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MSP430F4152IRGZT 参数 Datasheet PDF下载

MSP430F4152IRGZT图片预览
型号: MSP430F4152IRGZT
PDF下载: 下载PDF文件 查看货源
内容描述: 混合信号微控制器 [MIXED SIGNAL MICROCONTROLLER]
分类和应用: 微控制器和处理器外围集成电路装置PC时钟
文件页数/大小: 82 页 / 1554 K
品牌: TI [ TEXAS INSTRUMENTS ]
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MSP430F41x2  
MIXED SIGNAL MICROCONTROLLER  
SLAS648E -- APRIL 2009 -- REVISED MARCH 2011  
electrical characteristics over recommended operating free-air temperature (unless otherwise  
noted)  
crystal oscillator, LFXT1, low-frequency modes (see Note 4)  
PARAMETER  
TEST CONDITIONS  
XTS = 0, LFXT1Sx = 0 or 1  
XTS = 0, LFXT1Sx = 0,  
V
MIN  
TYP  
MAX UNIT  
CC  
LFXT1 oscillator crystal  
frequency, LF mode 0, 1  
f
1.8 V to 3.6 V  
32768  
Hz  
LFXT1,LF  
f
C
= 32768 kHz,  
= 6 pF  
500  
200  
LFXT1,LF  
L,eff  
Oscillation allowance for  
LF crystals  
OA  
kΩ  
LF  
XTS = 0, LFXT1Sx = 0,  
= 32768 kHz,  
f
LFXT1,LF  
C
L,eff  
= 12 pF  
XTS = 0, XCAPx = 0  
XTS = 0, XCAPx = 1  
XTS = 0, XCAPx = 2  
XTS = 0, XCAPx = 3  
1
5.5  
8.5  
11  
Integrated effective load  
capacitance, LF mode  
(see Note 1)  
C
L,eff  
pF  
XTS = 0,  
Duty cycle  
LF mode  
Measured at P1.6/ACLK,  
2.2 V/3 V  
2.2 V/3 V  
30  
10  
50  
70  
%
f
= 32768Hz  
LFXT1,LF  
Oscillator fault frequency,  
LF mode (see Note 3)  
XTS = 0, XCAPx = 0.  
LFXT1Sx = 3 (see Note 2)  
f
10000  
Hz  
Fault,LF  
NOTES: 1. Includes parasitic bond and package capacitance (approximately 2 pF per pin).  
Since the PCB adds additional capacitance it is recommended to verify the correct load by measuring the ACLK frequency. For a  
correct setup the effective load capacitance should always match the specification of the used crystal.  
2. Measured with logic level input frequency but also applies to operation with crystals.  
3. Frequencies below the MIN specification set the fault flag, frequencies above the MAX specification do not set the fault flag, and  
frequencies in between might set the flag.  
4. To improve EMI on the LFXT1 oscillator the following guidelines should be observed.  
-- Keep the trace between the device and the crystal as short as possible.  
-- Design a good ground plane around the oscillator pins.  
-- Prevent crosstalk from other clock or data lines into oscillator pins XIN and XOUT.  
-- Avoid running PCB traces underneath or adjacent to the XIN and XOUT pins.  
-- Use assembly materials and praxis to avoid any parasitic load on the oscillator XIN and XOUT pins.  
-- If conformal coating is used, ensure that it does not induce capacitive/resistive leakage between the oscillator pins.  
-- Do not route the XOUT line to the JTAG header to support the serial programming adapter as shown in other  
documentation. This signal is no longer required for the serial programming adapter.  
35  
POST OFFICE BOX 655303 DALLAS, TEXAS 75265  
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