MOC3020 THRU MOC3023
OPTOCOUPLERS/OPTOISOLATORS
SOES025 – OCTOBER 1986 – REVISED OCTOBER 1995
MECHANICAL INFORMATION
Each device consists of a gallium-arsenide infrared-emitting diode optically coupled to a silicon phototriac
mounted on a 6-terminal lead frame encapsulated within an electrically nonconductive plastic compound. The
case can withstand soldering temperature with no deformation and device performance characteristics remain
stable when operated in high-humidity conditions.
9,40 (0.370)
8,38 (0.330)
6
5
4
Index Dot
(see Note B)
C
L
C
L
1
2
3
7,62 (0.300) T.P.
(see Note A)
6,61 (0.260)
6,09 (0.240)
5,46 (0.215)
2,95 (0.116)
(see Note C)
1,78 (0.070)
0,51 (0.020)
1,78 (0.070) MAX
6 Places
105°
90°
0,305 (0.012)
0,203 (0.008)
Seating Plane
1,01 (0.040) MIN
3,81 (0.150)
3,17 (0.125)
2,03 (0.080)
1,52 (0.060)
4 Places
2,54 (0.100) T.P.
(see Note A)
0,534 (0.021)
0,381 (0.015)
6 Places
NOTES: A. Leads are within 0,13 (0.005) radius of true position (T.P.) with maximum material condition and unit installed.
B. Pin 1 identified by index dot.
C. Terminal connections:
1. Anode (part of the infrared-emitting diode)
2. Cathode (part of the infrared-emitting diode)
3. No internal connection
4. Main terminal (part of the phototransistor)
5. Triac Substrate (DO NOT connect) (part of the phototransistor)
6. Main terminal (part of the phototransistor)
D. The dimensions given fall within JEDEC MO-001 AM dimensions.
E. All linear dimensions are given in millimeters and parenthetically given in inches.
Figure 8. Mechanical Information
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
7–5
TI [ TEXAS INSTRUMENTS ]
