PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
LMV358IDR
LMV358IPWR
LMV358QDDUR
LMV358QDGKR
LMV358QDR
SOIC
TSSOP
VSSOP
MSOP
SOIC
D
8
8
8
8
8
8
2500
2000
3000
2500
2500
2000
330.0
330.0
180.0
330.0
330.0
330.0
12.4
12.4
9.2
6.4
7.0
2.25
5.3
6.4
7.0
5.2
3.6
3.35
3.4
5.2
3.6
2.1
1.6
1.05
1.4
2.1
1.6
8.0
8.0
4.0
8.0
8.0
8.0
12.0
12.0
8.0
Q1
Q1
Q3
Q1
Q1
Q1
PW
DDU
DGK
D
12.4
12.4
12.4
12.0
12.0
12.0
LMV358QPWR
TSSOP
PW
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LMV321IDBVR
LMV321IDBVR
LMV321IDBVT
LMV321IDBVT
LMV321IDCKR
LMV321IDCKR
LMV321IDCKT
LMV321IDCKT
LMV324IDR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
5
5
3000
3000
250
205.0
180.0
205.0
180.0
180.0
205.0
205.0
180.0
346.0
346.0
346.0
200.0
180.0
200.0
180.0
180.0
200.0
200.0
180.0
346.0
346.0
346.0
33.0
18.0
33.0
18.0
18.0
33.0
33.0
18.0
33.0
29.0
33.0
5
5
250
5
3000
3000
250
SC70
5
SC70
5
SC70
5
250
SOIC
14
14
14
2500
2000
2500
LMV324IPWR
LMV324QDR
TSSOP
SOIC
PW
D
Pack Materials-Page 2
TI [ TEXAS INSTRUMENTS ]
