PACKAGE MATERIALS INFORMATION
www.ti.com
17-Apr-2009
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
LMV321IDBVR
LMV321IDBVR
LMV321IDBVT
LMV321IDBVT
LMV321IDCKR
LMV321IDCKR
LMV321IDCKT
LMV321IDCKT
LMV324IDR
SOT-23
SOT-23
SOT-23
SOT-23
SC70
DBV
DBV
DBV
DBV
DCK
DCK
DCK
DCK
D
5
5
3000
3000
250
180.0
178.0
180.0
178.0
178.0
180.0
180.0
178.0
330.0
330.0
330.0
330.0
330.0
330.0
180.0
330.0
330.0
330.0
9.2
9.0
3.23
3.23
3.23
3.23
2.4
3.17
3.17
3.17
3.17
2.5
1.37
1.37
1.37
1.37
1.2
4.0
4.0
4.0
4.0
4.0
4.0
4.0
4.0
8.0
8.0
8.0
8.0
8.0
8.0
4.0
8.0
8.0
8.0
8.0
8.0
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q3
Q1
Q1
Q1
Q1
Q1
Q1
Q3
Q1
Q1
Q1
5
9.2
8.0
5
250
9.0
8.0
5
3000
3000
250
9.0
8.0
SC70
5
9.2
2.24
2.24
2.4
2.34
2.34
2.5
1.22
1.22
1.2
8.0
SC70
5
9.2
8.0
SC70
5
250
9.0
8.0
SOIC
14
14
14
14
16
16
8
2500
2000
2500
2000
2500
2000
3000
2500
2500
2500
16.4
12.4
16.4
12.4
16.4
12.4
9.2
6.5
9.0
2.1
16.0
12.0
16.0
12.0
16.0
12.0
8.0
LMV324IPWR
LMV324QDR
TSSOP
SOIC
PW
D
7.0
5.6
1.6
6.5
9.0
2.1
LMV324QPWR
LMV324SIDR
LMV324SIPWR
LMV358IDDUR
LMV358IDGKR
LMV358IDGKR
LMV358IDR
TSSOP
SOIC
PW
D
7.0
5.6
1.6
6.5
10.3
5.6
2.1
TSSOP
VSSOP
MSOP
MSOP
SOIC
PW
DDU
DGK
DGK
D
7.0
1.6
2.25
5.3
3.35
3.4
1.05
1.4
8
12.4
12.4
12.4
12.0
12.0
12.0
8
5.3
3.3
1.3
8
6.4
5.2
2.1
Pack Materials-Page 1
TI [ TEXAS INSTRUMENTS ]
