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LM4872ITPX 参数 Datasheet PDF下载

LM4872ITPX图片预览
型号: LM4872ITPX
PDF下载: 下载PDF文件 查看货源
内容描述: [IC,AUDIO AMPLIFIER,SINGLE,BGA,8PIN,PLASTIC]
分类和应用: 放大器商用集成电路
文件页数/大小: 15 页 / 465 K
品牌: TI [ TEXAS INSTRUMENTS ]
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Reference Design Board and PCB Layout Guidelines  
Application Information (Continued)  
10123025  
FIGURE 4. Reference Design Board  
PCB Layout Guidelines  
Single-Point Power / Ground Connections  
This section provides practical guidelines for mixed signal  
PCB layout that involves various digital/analog power and  
ground traces. Designers should note that these are only  
’rule-of-thumb’ recommendations and the actual results will  
depend heavily on the final layout.  
The analog power traces should be connected to the digital  
traces through a single point (link). A ’Pi-filter’ can be helpful  
in minimizing High Frequency noise coupling between the  
analog and digital sections. It is further recommended to put  
digital and analog power traces over the corresponding digi-  
tal and analog ground traces to minimize noise coupling.  
General Mixed Signal Layout Recommendation  
Power and Ground Circuits  
Placement of Digital and Analog Components  
All digital components and high-speed digital signals traces  
should be located as far away as possible from analog  
components and circuit traces.  
For 2 layer mixed signal design, it is important to isolate the  
digital power and ground trace paths from the analog power  
and ground trace paths. Star trace routing techniques (bring-  
ing individual traces back to a central point rather than daisy  
chaining traces together in a serial manner) can have a  
major impact on low level signal performance. Star trace  
routing refers to using individual traces to feed power and  
ground to each circuit or even device. This technique will  
take require a greater amount of design time but will not  
increase the final price of the board. The only extra parts  
required will be some jumpers.  
Avoiding Typical Design / Layout Problems  
Avoid ground loops or running digital and analog traces  
parallel to each other (side-by-side) on the same PCB layer.  
When traces must cross over each other do it at 90 degrees.  
Running digital and analog traces at 90 degrees to each  
other from the top to the bottom side as much as possible will  
minimize capacitive noise coupling and cross talk.  
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