Physical Dimensions inches (millimeters) unless otherwise noted
Note: Unless otherwise specified.
1. Epoxy coating.
2. 63Sn/37Pb eutectic bump.
3. Recommend non-solder mask defined landing pad.
4. Pin 1 is established by lower left corner with respect to text orientation pins are numbered counterclockwise.
5. Reference JEDEC registration MO-211, variation BC.
8-Bump micro SMD
Order Number LM4872IBP, LM4872IBPX
NS Package Number BPA08B6B
X1 = 1.31 0.03 X2 = 1.97 0.03 X3 = 0.850 0.10
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