PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM293DR
LM293DR
SOIC
SOIC
SOIC
SOIC
SOIC
VSSOP
SOIC
SOIC
SOIC
SOIC
SO
D
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2500
2500
2500
2000
2000
2500
2500
2500
2500
2500
2500
2000
2000
2000
367.0
364.0
364.0
367.0
340.5
364.0
367.0
340.5
367.0
340.5
367.0
364.0
364.0
340.5
367.0
364.0
340.5
367.0
367.0
364.0
364.0
367.0
364.0
364.0
367.0
338.1
364.0
367.0
338.1
367.0
338.1
367.0
364.0
364.0
338.1
367.0
364.0
338.1
367.0
367.0
364.0
364.0
35.0
27.0
27.0
35.0
20.6
27.0
35.0
20.6
35.0
20.6
38.0
27.0
27.0
20.6
35.0
27.0
20.6
35.0
38.0
27.0
27.0
LM293DRG3
LM293DRG4
LM293DRG4
LM393ADGKR
LM393ADR
LM393ADR
LM393ADRG4
LM393ADRG4
LM393APSR
LM393APWR
LM393DGKR
LM393DR
D
D
D
DGK
D
D
D
D
PS
PW
DGK
D
TSSOP
VSSOP
SOIC
SOIC
SOIC
SOIC
SOIC
SO
LM393DR
D
LM393DRG3
LM393DRG4
LM393DRG4
LM393PSR
D
D
D
PS
PW
PW
LM393PWR
LM393PWRG3
TSSOP
TSSOP
Pack Materials-Page 4
TI [ TEXAS INSTRUMENTS ]
