PACKAGE MATERIALS INFORMATION
www.ti.com
23-Oct-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM193DR
LM2903DGKR
LM2903DR
SOIC
VSSOP
SOIC
D
DGK
D
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
8
2500
2500
2500
2500
2500
2500
2500
2000
2000
2000
2000
2500
2000
2500
2500
2500
2500
2500
2500
2500
367.0
364.0
340.5
367.0
364.0
340.5
367.0
367.0
364.0
367.0
364.0
367.0
367.0
364.0
367.0
340.5
367.0
340.5
364.0
340.5
367.0
364.0
338.1
367.0
364.0
338.1
367.0
367.0
364.0
367.0
364.0
367.0
367.0
364.0
367.0
338.1
367.0
338.1
364.0
338.1
35.0
27.0
20.6
35.0
27.0
20.6
35.0
38.0
27.0
35.0
27.0
35.0
35.0
27.0
35.0
20.6
35.0
20.6
27.0
20.6
LM2903DR
SOIC
D
LM2903DRG3
LM2903DRG4
LM2903DRG4
LM2903PSR
LM2903PWR
LM2903PWR
LM2903PWRG3
LM2903QDRG4
LM2903VQPWRG4
LM293ADGKR
LM293ADR
SOIC
D
SOIC
D
SOIC
D
SO
PS
PW
PW
PW
D
TSSOP
TSSOP
TSSOP
SOIC
TSSOP
VSSOP
SOIC
PW
DGK
D
LM293ADR
SOIC
D
LM293ADRG4
LM293ADRG4
LM293DGKR
LM293DR
SOIC
D
SOIC
D
VSSOP
SOIC
DGK
D
Pack Materials-Page 3
TI [ TEXAS INSTRUMENTS ]
