SNIS159C – AUGUST 1999 – REVISED JULY 2013
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
CONNECTION DIAGRAMS
METAL CAN PACKAGE
TO (NDV)
SMALL-OUTLINE MOLDED PACKAGE
SOIC-8 (D)
TOP VIEW
+V
S
V
OUT
t
GND
V
OUT
N.C.
N.C.
GND
1
2
3
4
8
7
6
5
+V
S
N.C.
N.C.
N.C.
Case is connected to negative pin (GND)
N.C. = No connection
PLASTIC PACKAGE
TO-92 (LP)
BOTTOM VIEW
PLASTIC PACKAGE
TO-220 (NEB)
+V
S
V
OUT
GND
LM
35DT
+V
S
GND
V
OUT
Tab is connected to the negative pin
(GND).
NOTE:
The LM35DT pinout is different than
the discontinued LM35DP
2
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