PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM211DR
LM211DR
LM211PWR
LM311DR
LM311DR
LM311PSR
LM311PWR
SOIC
SOIC
TSSOP
SOIC
SOIC
SO
D
D
8
8
8
8
8
8
8
2500
2500
2000
2500
2500
2000
2000
346.0
340.5
346.0
346.0
340.5
346.0
346.0
346.0
338.1
346.0
346.0
338.1
346.0
346.0
29.0
20.6
29.0
29.0
20.6
33.0
29.0
PW
D
D
PS
PW
TSSOP
Pack Materials-Page 2