PACKAGE MATERIALS INFORMATION
www.ti.com
19-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
LM211DR
LM211DR
LM211PWR
LM311DR
LM311DR
LM311PSR
LM311PWR
SOIC
SOIC
TSSOP
SOIC
SOIC
SO
D
D
8
8
8
8
8
8
8
2500
2500
2000
2500
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
12.4
12.4
12.4
12.4
12.4
16.4
12.4
6.4
6.4
7.0
6.4
6.4
8.2
7.0
5.2
5.2
3.6
5.2
5.2
6.6
3.6
2.1
2.1
1.6
2.1
2.1
2.5
1.6
8.0
8.0
8.0
8.0
8.0
12.0
8.0
12.0
12.0
12.0
12.0
12.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
PW
D
D
PS
PW
TSSOP
Pack Materials-Page 1