Absolute Maximum Ratings (Note 2)
Input Voltage
Power Dissipation (Note 3)
Junction Temperature (TJmax
Storage Temperature
−26V to +0.3V
Internally Limited
150°C
)
−65°C ≤ TA ≤ +150°C
Thermal Resistance
ꢀꢀθJA
Ceramic Dip (Still Air @ 0.5°C/W)
Ceramic Dip (500LF/Min Air flow @ 0.5°C/W)
ꢀꢀθJC
75°C/W
35°C/W
Ceramic Dip (Note 4)
5°C/W
Package Weight
Ceramic Dip
Lead Temperature (Soldering, 10 sec.)
ESD Susceptibility (Note 5)
TBD
260°C
2KV
Recommended Operating Conditions (Note 2)
Temperature Range (TJ)
−55°C ≤ TJ ≤ +125°C
Maximum Input Voltage (Operational)
−26V
Quality Conformance Inspection
Mil-Std-883, Method 5005 - Group A
Subgroup
Description
Static tests at
Temp (°C)
1
2
+25
+125
-55
Static tests at
3
Static tests at
4
Dynamic tests at
Dynamic tests at
Dynamic tests at
Functional tests at
Functional tests at
Functional tests at
Switching tests at
Switching tests at
Switching tests at
Settling time at
Settling time at
Settling time at
+25
+125
-55
5
6
7
+25
+125
-55
8A
8B
9
+25
+125
-55
10
11
12
13
14
+25
+125
-55
3
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