PACKAGE MATERIALS INFORMATION
www.ti.com
26-Mar-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
LM2675LD-5.0
LM2675LD-5.0/NOPB
LM2675LD-ADJ
WSON
WSON
WSON
WSON
WSON
WSON
SOIC
NHN
NHN
NHN
NHN
NHN
NHN
D
16
16
16
16
16
16
8
1000
1000
1000
1000
4500
4500
2500
2500
2500
2500
2500
2500
2500
210.0
213.0
210.0
213.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
185.0
191.0
185.0
191.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
367.0
35.0
55.0
35.0
55.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
35.0
LM2675LD-ADJ/NOPB
LM2675LDX-ADJ
LM2675LDX-ADJ/NOPB
LM2675MX-12
LM2675MX-12/NOPB
LM2675MX-3.3
SOIC
D
8
SOIC
D
8
LM2675MX-3.3/NOPB
LM2675MX-5.0/NOPB
LM2675MX-ADJ
SOIC
D
8
SOIC
D
8
SOIC
D
8
LM2675MX-ADJ/NOPB
SOIC
D
8
Pack Materials-Page 2