PACKAGE OPTION ADDENDUM
www.ti.com
16-Aug-2013
Orderable Device
Status Package Type Package Pins Package
Eco Plan Lead/Ball Finish
MSL Peak Temp
Op Temp (°C)
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
-40 to 125
Device Marking
Samples
Drawing
Qty
(1)
(2)
(3)
(4/5)
LM2675MX-5.0/NOPB
LM2675MX-ADJ
ACTIVE
SOIC
SOIC
SOIC
PDIP
PDIP
PDIP
PDIP
PDIP
PDIP
PDIP
PDIP
D
8
8
8
8
8
8
8
8
8
8
8
2500
Green (RoHS
& no Sb/Br)
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Call TI
CU SN
Level-1-260C-UNLIM
2675
M5.0
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
ACTIVE
D
D
P
P
P
P
P
P
P
P
2500
2500
40
TBD
Call TI
2675
MADJ
LM2675MX-ADJ/NOPB
LM2675N-12
Green (RoHS
& no Sb/Br)
Level-1-260C-UNLIM
Call TI
2675
MADJ
TBD
LM2675
N-12
LM2675N-12/NOPB
LM2675N-3.3
40
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Call TI
LM2675
N-12
40
TBD
LM2675
N-3.3
LM2675N-3.3/NOPB
LM2675N-5.0
40
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Call TI
LM2675
N-3.3
40
TBD
LM2675
N-5.0
LM2675N-5.0/NOPB
LM2675N-ADJ
40
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
Call TI
LM2675
N-5.0
40
TBD
LM2675
N-ADJ
LM2675N-ADJ/NOPB
40
Green (RoHS
& no Sb/Br)
Level-1-NA-UNLIM
LM2675
N-ADJ
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Addendum-Page 2
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