SNOS412L – MAY 2004 – REVISED JULY 2012
Figure 5. TO-263 Top View
Figure 6. Side View
ADJ/GND
1
8
NOT CONNECTED
V
IN
V
IN
V
IN
2
V
OUT
3
7
V
OUT
V
OUT
V
OUT
6
4
5
When using the LLP package
Pins 2, 3 & 4 must be connected together and
Pins 5, 6 & 7 must be connected together
Figure 7. LLP Top View
ABSOLUTE MAXIMUM RATINGS
(1)
Maximum Input Voltage (V
IN
to GND)
Power Dissipation
(2)
20V
Internally Limited
150°C
-65°C to 150°C
260°C, 10 sec
260°C, 4 sec
2000V
Junction Temperature (T
J
)
(2)
Storage Temperature Range
Lead Temperature
TO-220 (T) Package
SOT-223 (IMP) Package
ESD Tolerance
(3)
(1)
(2)
(3)
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of T
J(max)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
For testing purposes, ESD was applied using human body model, 1.5kΩ in series with 100pF.
OPERATING RATINGS
(1)
Input Voltage (V
IN
to GND)
Junction Temperature Range (T
J
)
LM1117
LM1117I
(1)
(2)
(2)
15V
0°C to 125°C
−40°C
to 125°C
Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for
which the device is intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test
conditions, see the Electrical Characteristics.
The maximum power dissipation is a function of T
J(max)
,
θ
JA
, and T
A
. The maximum allowable power dissipation at any ambient
temperature is P
D
= (T
J(max)
–T
A
)/θ
JA
. All numbers apply for packages soldered directly into a PC board.
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