SNOS412L – MAY 2004 – REVISED JULY 2012
LM1117 ELECTRICAL CHARACTERISTICS (continued)
Typicals and limits appearing in normal type apply for T
J
= 25°C. Limits appearing in
Boldface
type apply over the entire
junction temperature range for operation, 0°C to 125°C.
Symbol
Parameter
Quiescent Current
LM1117-1.8
V
IN
≤
15V
LM1117-2.5
V
IN
≤
15V
LM1117-2.85
V
IN
≤
10V
LM1117-3.3
V
IN
≤
15V
LM1117-5.0
V
IN
≤
15V
Thermal Regulation
Ripple Regulation
Adjust Pin Current
Adjust Pin Current
Change
Temperature Stability
Long Term Stability
RMS Output Noise
Thermal Resistance
Junction-to-Case
T
A
= 125°C, 1000Hrs
(% of V
OUT
), 10Hz
≤
f
≤10kHz
3-Lead SOT-223
3-Lead TO-220
3-Lead TO-252
Thermal Resistance
Junction-to-Ambient
(No air flow)
3-Lead SOT-223 (No heat sink)
3-Lead TO-220 (No heat sink)
3-Lead TO-252
3-Lead TO-263
8-Lead LLP
(6)
(7)
(7)
(6)
Conditions
Min
(1)
Typ
(2)
5
5
Max
(1)
10
10
Units
mA
mA
5
5
5
0.01
60
75
60
10
10
10
0.1
mA
mA
mA
%/W
dB
T
A
= 25°C, 30ms Pulse
f
RIPPLE
=1 20Hz, V
IN
-V
OUT
= 3V V
RIPPLE
=
1V
PP
10
≤
I
OUT
≤
800mA,
1.4V
≤
V
IN
-V
OUT
≤
10V
120
5
μA
μA
%
%
%
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
°C/W
0.2
0.5
0.3
0.003
15.0
3.0
10
136
79
92
55
40
(No heat sink)
Minimum pad size of 0.038in
2
Thermal Performance for the LLP was obtained using JESD51-7 board with six vias and an ambient temperature of 22°C. For
information about improved thermal performance and power dissipation for the LLP, refer to Application Note AN-1187.
Copyright © 2004–2012, Texas Instruments Incorporated
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