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LM1117DTX-ADJ 参数 Datasheet PDF下载

LM1117DTX-ADJ图片预览
型号: LM1117DTX-ADJ
PDF下载: 下载PDF文件 查看货源
内容描述: 800毫安低压差线性稳压器 [800mA Low-Dropout Linear Regulator]
分类和应用: 稳压器
文件页数/大小: 25 页 / 458 K
品牌: TI [ TEXAS INSTRUMENTS ]
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LM1117/LM1117I  
10091916  
FIGURE 6. Power Dissipation Diagram  
The next parameter which must be calculated is the maximum allowable temperature rise, TR(max):  
TR(max) = TJ(max)-TA(max)  
where TJ(max) is the maximum allowable junction temperature (125°C), and TA(max) is the maximum ambient temperature which  
will be encountered in the application.  
Using the calculated values for TR(max) and PD, the maximum allowable value for the junction-to-ambient thermal resistance  
(θJA) can be calculated:  
ꢀθJA = TR(max)/PD  
If the maximum allowable value for θJA is found to be 136°C/W for SOT-223 package or 79°C/W for TO-220 package or 92°  
C/W for TO-252 package, no heatsink is needed since the package alone will dissipate enough heat to satisfy these requirements.  
If the calculated value for θJA falls below these limits, a heatsink is required.  
As a design aid, Table 1 shows the value of the θJA of SOT-223 and TO-252 for different heatsink area. The copper patterns that  
we used to measure these θJAs are shown at the end of the Application Notes Section. Figure 7 and Figure 8 reflects the same  
test results as what are in the Table 1  
Figure 9 and Figure 10 shows the maximum allowable power dissipation vs. ambient temperature for the SOT-223 and TO-252  
device. Figures Figure 11 and Figure 12 shows the maximum allowable power dissipation vs. copper area (in2) for the SOT-223  
and TO-252 devices. Please see AN1028 for power enhancement techniques to be used with SOT-223 and TO-252 packages.  
*Application Note AN-1187 discusses improved thermal performance and power dissipation for the LLP.  
TABLE 1. θJA Different Heatsink Area  
Layout  
Copper Area  
Thermal Resistance  
Top Side (in2)*  
Bottom Side (in2)  
(θJA,°C/W) SOT-223  
(θJA,°C/W) TO-252  
1
2
0.0123  
0.066  
0.3  
0
0
136  
123  
84  
103  
87  
60  
54  
52  
47  
84  
70  
63  
57  
57  
89  
72  
61  
55  
53  
3
0
4
0.53  
0.76  
1
0
75  
5
0
69  
6
0
66  
7
0
0.2  
0.4  
0.6  
0.8  
1
115  
98  
8
0
9
0
89  
10  
11  
12  
13  
14  
15  
16  
0
82  
0
79  
0.066  
0.175  
0.284  
0.392  
0.5  
0.066  
0.175  
0.284  
0.392  
0.5  
125  
93  
83  
75  
70  
*Tab of device attached to topside copper  
14  
Copyright © 1999-2012, Texas Instruments Incorporated  
 
 
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