ISO1540
ISO1541
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SLLSEB6 –JULY 2012
Table 4. IEC 60664-1 RATINGS TABLE
PARAMETER
TEST CONDITIONS
Material group
SPECIFICATION
Basic isolation group
II
Rated mains voltage ≤ 150 VRMS
Rated mains voltage ≤ 300 VRMS
Rated mains voltage ≤ 400 VRMS
I–IV
I–III
I–II
Installation classification
Table 5. REGULATORY INFORMATION
VDE
CSA
UL
Certified according to DIN EN 60747-5-2
(VDE 0884 Part 2) and EN 61010-1
Approved under CSA Component Acceptance Notice
#5A, CSA/IEC 60950-1 & CSA/IEC 61010-1
Recognized under UL 1577
Component Recognition Program
Basic insulation per CSA 60950-1-07 and IEC 60950-1
(2nd Ed), 390 VRMS maximum working voltage
Basic insulation per CSA 61010-1-04 and IEC 61010-1
(2nd Ed), 300 VRMS maximum working voltage
Reinforced insulation per CSA 61010-1-04 and IEC
61010-1 (2nd Ed), 150 VRMS maximum working
voltage
Basic Insulation
Maximum Transient Overvoltage, 4000 VPK
Maximum Surge Voltage, 4000 VPK
Maximum Working Voltage, 566 VPK
Single Protection Isolation Voltage,
(1)
2500 VRMS
File number: 40016131 (pending)
File number: 220991 (pending)
File number: E181974
(1) Production tested ≥ 3000 VRMS for 1 second in accordance with UL 1577.
IEC SAFETY LIMITING VALUES
Safety limiting intends to prevent potential damage to the isolation barrier upon failure of input or output circuitry.
A failure of the IO can allow low resistance to ground or the supply and, without current limiting, dissipate
sufficient power to overheat the die and damage the isolation barrier potentially leading to secondary system
failures.
PARAMETER
TEST CONDITIONS
MIN TYP MAX UNIT
θJA = 114.6°C/W, VI = 5.5V, TJ = 150°C, TA = 25°C
θJA = 114.6°C/W, VI = 3.6V, TJ = 150°C, TA = 25°C
198
mA
303
Safety input, output, or supply
current
IS
D-8
TS Maximum case temperature
150
°C
The safety-limiting constraint is the absolute maximum junction temperature specified in the absolute maximum
ratings table. The power dissipation and junction-to-air thermal impedance of the device installed in the
application hardware determines the junction temperature. The assumed junction-to-air thermal resistance in the
Thermal Information table is that of a device installed on a High-K Test Board for Leaded Surface Mount
Packages. The power is the recommended maximum input voltage times the current. The junction temperature is
then the ambient temperature plus the power times the junction-to-air thermal resistance.
ISO154x THERMAL DERATING
350
VCC1 = VCC2 = 3.6 V
300
250
200
VCC1 = VCC2 = 5.5 V
150
100
50
0
0
50
100
Case Temperature (oC)
150
200
Figure 5.
Copyright © 2012, Texas Instruments Incorporated
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