PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
*All dimensions are nominal
Device
Package Type Package Drawing Pins
SPQ
Length (mm) Width (mm) Height (mm)
CD4518BM96
CD4518BNSR
CD4518BPWR
CD4520BM96
CD4520BNSR
CD4520BPWR
SOIC
SO
D
16
16
16
16
16
16
2500
2000
2000
2500
2000
2000
333.2
367.0
367.0
333.2
367.0
367.0
345.9
367.0
367.0
345.9
367.0
367.0
28.6
38.0
35.0
28.6
38.0
35.0
NS
PW
D
TSSOP
SOIC
SO
NS
PW
TSSOP
Pack Materials-Page 2