PACKAGE MATERIALS INFORMATION
www.ti.com
26-Jan-2013
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0
B0
K0
P1
W
Pin1
Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
CD4518BM96
CD4518BNSR
CD4518BPWR
CD4520BM96
CD4520BNSR
CD4520BPWR
SOIC
SO
D
16
16
16
16
16
16
2500
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
16.4
16.4
12.4
6.5
8.2
6.9
6.5
8.2
6.9
10.3
10.5
5.6
2.1
2.5
1.6
2.1
2.5
1.6
8.0
12.0
8.0
16.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
TSSOP
SOIC
SO
10.3
10.5
5.6
8.0
NS
PW
12.0
8.0
TSSOP
Pack Materials-Page 1