PACKAGE MATERIALS INFORMATION
www.ti.com
11-Mar-2008
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
SPQ
Reel
Reel
A0 (mm)
B0 (mm)
K0 (mm)
P1
W
Pin1
Diameter Width
(mm) W1 (mm)
(mm) (mm) Quadrant
CD4073BM96
CD4073BNSR
CD4073BPWR
CD4081BM96
CD4081BNSR
CD4081BPWR
CD4082BM96
CD4082BNSR
CD4082BPWR
SOIC
SO
D
14
14
14
14
14
14
14
14
14
2500
2000
2000
2500
2000
2000
2500
2000
2000
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
330.0
16.4
16.4
12.4
16.4
16.4
12.4
16.4
16.4
12.4
6.5
8.2
7.0
6.5
8.2
7.0
6.5
8.2
7.0
9.0
10.5
5.6
2.1
2.5
1.6
2.1
2.5
1.6
2.1
2.5
1.6
8.0
12.0
8.0
16.0
16.0
12.0
16.0
16.0
12.0
16.0
16.0
12.0
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
Q1
NS
PW
D
TSSOP
SOIC
SO
9.0
8.0
NS
PW
D
10.5
5.6
12.0
8.0
TSSOP
SOIC
SO
9.0
8.0
NS
PW
10.5
5.6
12.0
8.0
TSSOP
Pack Materials-Page 1